AW ™ The series of products includes ultrasonic scanners and optical microscopes, which are specialized in designing automatic C-SAM solutions for bonding wafers and silicon wafers ® The system software has a large volume, high production capacity, and high sensitivity. Generally used for detecting wafers such as SOI and MEMS. Because this raw material is almost completely transparent to ultrasound, Sonoscan uses its own professionally developed high-frequency camera for analysis to obtain the most detailed images. The AW series products can detect cracks with a diameter below 5 μ m and layers as thin as 200 angstroms. AW ™ The series of products are excellent automation technology wafers C-Sam with large space and high cargo capacity ® Instruments and equipment, specialized in assessing the sensitivity of wafer and machine equipment level applications. The AW series products can demonstrate a sensitivity of about 5 μ m, which is twice as fast as market competition system software, and its non penetrating scanning machine can prevent false reporting caused by double distilled water intrusion.

AW series products automatically resolve and regularly inspect the arrangement of wafers based on customer defined acceptance/rejection specifications. This product is designed to address wafer level products (BSI controllers SOI、MEMS、LED、 On chip integrated IC and unpolished wafer, including bonding processing techniques such as immediate fusion, anodizing, laminated glass melting, and epoxy resin bonding.

1. Immediate bonding technology - System software customers have found that conducting inspections in the three production and manufacturing processes of Van der Waals original bonding, quenching, and dilution solution can significantly improve efficiency.

2. MEMS machine equipment - capable of verifying the quality of cavity sealing before separation.

3. Unprocessed raw chips - check for natural gaps caused by "needle holes" during further production processes.

4. The fusion of LED inspection layer and fully automatic grinding tool is basically used to classify bad and abnormal grinding tools.

The AW series products utilize Sonoscan's unique high-frequency acoustic lenses, which are designed internally to provide detailed images. Because the raw materials used in this application, such as silicon, emerald, laminated glass, gallium arsenide, etc., are highly transparent to ultrasound, unique lenses are necessary. Can detect the layers in the middle of wafers as thin as 200 angstroms.

AW300 series products are presented with automatic inspection, in compliance with SECS/GEM standards, and can be customized according to your specifications.